The typical peak temperature will be 235°-245☌ degrees with 60-90 seconds over reflow (217☌). in a leadfree application the soak zone time (150°-217☌) can be 60- 90 seconds. The typical peak temperature will be 205°-215☌ degrees with 60-90 seconds over reflow (183☌). In a leaded application, the soak zone time (150☌-184☌) can be 60-90 seconds. This allows the use of tacky flux in a leaded or lead-free application.
FLUX SOLDER FREE
Can be used in Pb free or Sn/Pb processesĪpplication for paste flux used for making solder paste.Capable for high density as well as general purpose Lead-Free soldering processes.Excellent Lead-Free soldering performance on various board finishes.Specifically designed for use on Cu-OSP PCBs Benefits:.Good micro-solder ball performance in Lead-Free applications.Low bridging performance on connectors.Good hole-fill demonstrated by >96% yield on 10 mil holes.
FLUX SOLDER FULL
Its rosin-base and alcohol-based fluxes provide excellent wetting, virtually defect-free soldering and high line throughput across the full range of applications. The BBIEN soldering flux line is unsurpassed in providing wave soldering process solutions. It can be also make claficication as high temperature Sn-Ag-Cu flux low temperature Sn-Bi,Sn-Bi-Ag flux and tin-lead flux for Sn-Pb alloy solder paste.īBIEN no clean tacky fluxes offer environmentally friendly benefits, while providing unmatched soldering performance. Our latest line of wave solder fluxes, including our lead free flux and tin lead flux is designed to provide the highest level of performance and reliability in its class. Additionally, it provides good lead free solder joint cosmetics with an evenly spread, tack free residue. Our tacky flux is a rosin-containing flux designed to provide the attributes of excellent solderability and reliability in general and high-density boards in both Lead-Free and eutectic tin/lead processes. Other key benefits include excellent cleaning properties and long tackiness life. Our halogen free tack flux designed for bumping, BGA and CSP applications which delivers superior wettability on various pad finishes such as CuOSP, electrolytic Ni-Au and ENIG.
FLUX SOLDER MANUAL
Whether using lead-free or lead-based solder, our solder flux delivers exceptional workability in both manual and automated processes.BBIEN tacky flux is a no clean type of tacky solder flux past. HARIMA helps manufacturers meet these challenges with a range of high-quality flux materials suitable for any application in any industry. Moreover, solder fluxes also help enable the high mechanical strength of joints which may also be important in automotive applications where vibration and impact resistance is required. Cleaning and purification of joints is among the most important factors for ensuring precision electronics in consumer goods. In any soldering application, various challenges may present themselves to the manufacturer depending on the exact application.
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